(IC-EPAE - 26) | Hybrid Event
15th - 16th May 2026 | Las vegas, USA

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International Conference on Electronics Packaging and Assembly Engineering
(IC-EPAE - 26)

15th - 16th May 2026 Las vegas, USA (Hybrid Event)

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Call for Paper

The IC-EPAE is committed to addressing global challenges through impactful research and sustainable solutions. It brings together researchers dedicated to advancing knowledge for societal benefit. Focusing on Electrical and Electronics Engineering, the conference promotes research aligned with global development goals and long-term sustainability. Authors are invited to submit papers addressing, but not limited to, the following areas:

  • Advancements in electronics packaging technologies
  • Thermal management in electronics packaging
  • Reliability testing for electronic assemblies
  • Sustainable practices in electronics packaging
  • Integration of IoT in packaging systems
  • Challenges in electronics assembly processes
  • Quality control in electronics packaging
  • Emerging materials for electronics packaging
  • Design considerations for electronic assemblies
  • Automation in electronics manufacturing
  • Future trends in electronics packaging
  • Supply chain management for electronics assembly
  • Impact of 5G on electronics packaging
  • Electromagnetic compatibility in packaging
  • Case studies in electronics packaging engineering
  • Packaging solutions for wearable electronics
  • Robustness of electronic assemblies
  • Testing methodologies for electronics packaging
  • Industry standards for electronics packaging
  • Research directions in electronics assembly
Review & Publication

All submissions will be reviewed for their contribution to global impact and research quality. Accepted papers will be presented and considered for publication in reputed platforms.

Registration

Join participants from around the world by completing your registration and becoming part of a global research community.

Publication

Accepted papers will gain international exposure through conference presentations and publication opportunities.

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