(ICMSMEI - 26) | Hybrid Event
22nd - 23rd August 2026 | Paris, France

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International Conference on Materials Science and Mechanical Engineering Innovations
(ICMSMEI - 26)

22nd - 23rd August 2026 Paris, France (Hybrid Event)

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Call for Paper

The ICMSMEI is committed to addressing global challenges through impactful research and sustainable solutions. It brings together researchers dedicated to advancing knowledge for societal benefit. Focusing on Mechanical Engineering, the conference promotes research aligned with global development goals and long-term sustainability. Authors are invited to submit papers addressing, but not limited to, the following areas:

  • Advancements in composite materials technology
  • Mechanical properties of advanced materials
  • Innovative manufacturing techniques for materials
  • Sustainable materials in engineering applications
  • Nanomaterials and their mechanical properties
  • Smart materials for engineering innovations
  • Failure analysis of engineering materials
  • Characterization techniques for new materials
  • Materials for extreme environments
  • Recycling and sustainability in materials science
  • Mechanical behavior of biomaterials
  • Additive manufacturing of metallic materials
  • Surface engineering of mechanical components
  • Materials for renewable energy applications
  • Thermal properties of engineering materials
  • Corrosion resistance in mechanical engineering
  • Advanced ceramics in mechanical applications
  • Computational materials science techniques
  • Mechanical testing methods for materials
  • Future trends in materials science research
Review & Publication

All submissions will be reviewed for their contribution to global impact and research quality. Accepted papers will be presented and considered for publication in reputed platforms.

Registration

Join participants from around the world by completing your registration and becoming part of a global research community.

Publication

Accepted papers will gain international exposure through conference presentations and publication opportunities.

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