SNRI

(ICTMEA - 27) | Hybrid Event
11th - 12th May 2027 | Bali, Indonesia

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International Conference on Tribology and Mechanical Engineering Applications
(ICTMEA - 27)

11th - 12th May 2027 Bali, Indonesia (Hybrid Event)

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Call for Paper

The ICTMEA is committed to addressing global challenges through impactful research and sustainable solutions. It brings together researchers dedicated to advancing knowledge for societal benefit. Focusing on Mechanical Engineering, the conference promotes research aligned with global development goals and long-term sustainability. Authors are invited to submit papers addressing, but not limited to, the following areas:

  • Tribological principles in mechanical engineering
  • Wear and friction in engineering applications
  • Lubrication technologies for mechanical systems
  • Surface engineering for tribological applications
  • Tribology in automotive engineering
  • Nanotribology and its engineering implications
  • Experimental techniques in tribology research
  • Tribological challenges in manufacturing processes
  • Impact of tribology on energy efficiency
  • Tribological coatings for mechanical components
  • Tribology in biomedical engineering applications
  • Future trends in tribological research
  • Tribology for sustainable engineering practices
  • Modeling and simulation in tribology
  • Tribological issues in renewable energy systems
  • Education and training in tribology
  • Case studies in tribological failures
  • Innovative materials for tribological applications
  • Tribology in aerospace engineering
  • Collaborative research in tribology
Review & Publication

All submissions will be reviewed for their contribution to global impact and research quality. Accepted papers will be presented and considered for publication in reputed platforms.

Registration

Join participants from around the world by completing your registration and becoming part of a global research community.

Publication

Accepted papers will gain international exposure through conference presentations and publication opportunities.

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